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Sunday 4 March 2018

Undergraduate Excellence Scholarships At Bond University For International Students.

Bond University is offering high academic achievers who are living outside of Australia and applying to study at an undergraduate level, with tuition remission scholarships. The Undergraduate Excellence Scholarships are awarded on the basis of academic excellence and are a testament to Bond University’s commitment to quality and outstanding international students. To be considered for the scholarships applicant must complete the Bond University Online Application Form (see below) and have received an offer before applying for this scholarship. The Bond University is a private not-for-profit university located in Robina, Gold Coast, Queensland, Australia. It has been listed in the global top 20 universities in the Times Higher Education (THE) Rankings of the Best Small Universities in the World. Bond was also recently ranked as Australia’s number one university for student experience for the 12th consecutive year in the 2018 Good Universities' Guide. Since its inception in 1989, Bond University has primarily been a teaching focused higher education institution.

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Scholarships details
Value: Part Fee
Level: Undergraduate
Target: International Students.

Eligibility
To be considered, applicants must:
  • Have already received an offer from Bond University to commence an undergraduate degree. Students who have not yet received an offer can apply via the Bond University Online Application.
  • Currently reside outside of Australia.
  • Have outstanding academic ability.
  • Complete and submit the Undergraduate Excellence Scholarships Application Form by the scholarship application closing date.
  • Not have already commenced studies at Bond University.
The following programs are not eligible for consideration for scholarships:
–Master of Psychology, Study Abroad and Exchange Programs, Bachelor of Medical Studies and Doctor of Physiotherapy.

Following the closing date, Bond University will select the successful applicants on a competitive, merit-based process. This will include review of each applicants’ academic achievement as demonstrated by their academic results from their home country qualification and supporting statement.

Scholarship Conditions
The successful award recipient must:
  • comply with Bond’s general scholarship terms and conditions
  • maintain a minimum average of 65% or better in their program
  • be enrolled on a full-time basis
  • participate in promotional activities arranged by the University.
  • Awards are non-transferrable and cannot be redeemed for cash.

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Apply for scholarships here!

Deadline: May 25, 2018.

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